JPH0737332Y2 - プリント基板 - Google Patents
プリント基板Info
- Publication number
- JPH0737332Y2 JPH0737332Y2 JP1989058762U JP5876289U JPH0737332Y2 JP H0737332 Y2 JPH0737332 Y2 JP H0737332Y2 JP 1989058762 U JP1989058762 U JP 1989058762U JP 5876289 U JP5876289 U JP 5876289U JP H0737332 Y2 JPH0737332 Y2 JP H0737332Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- pattern
- positioning
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 9
- 238000010586 diagram Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989058762U JPH0737332Y2 (ja) | 1989-05-22 | 1989-05-22 | プリント基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989058762U JPH0737332Y2 (ja) | 1989-05-22 | 1989-05-22 | プリント基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH031470U JPH031470U (en]) | 1991-01-09 |
| JPH0737332Y2 true JPH0737332Y2 (ja) | 1995-08-23 |
Family
ID=31584667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989058762U Expired - Lifetime JPH0737332Y2 (ja) | 1989-05-22 | 1989-05-22 | プリント基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0737332Y2 (en]) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5710770U (en]) * | 1980-06-20 | 1982-01-20 | ||
| JPS6071170U (ja) * | 1983-10-21 | 1985-05-20 | 三菱電機株式会社 | 部品取付機構 |
-
1989
- 1989-05-22 JP JP1989058762U patent/JPH0737332Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH031470U (en]) | 1991-01-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |